WAFER STACKING TO FORM A MULTI-WAFER-BONDED STRUCTURE
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United States of America Patent
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app pub date -
Sep 7, 2016
filing date -
Sep 7, 2016
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Abstract
In one aspect, a method includes heating a wafer chuck, heating a first wafer, depositing a first epoxy along at least a portion of a surface of the first wafer disposed on the wafer chuck, spinning the wafer chuck to spread the first epoxy at least partially across the first wafer, placing a second wafer on the first epoxy disposed on the first wafer and bonding the second wafer to the first epoxy under vacuum to form a two-wafer-bonded structure.
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