SUBSTRATE PROCESSING APPARATUS

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United States of America Patent

APP PUB NO 20180068875A1
SERIAL NO

15691943

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus includes: a spin chuck adapted to hold a substrate having a substantially circular outer shape with the principal surface of the substrate set substantially horizontally and rotate the substrate with the center of the substrate as a rotation center; a processing liquid ejection nozzle adapted to eject a processing liquid to the circumferential edge part of the substrate rotated held by the spin chuck; and a cup adapted to be disposed in the external circumferential part of the substrate rotated held by the spin chuck and collect the processing liquid scattered from the substrate, and further includes, above the surface of the substrate rotated held by the spin chuck, an anti-splash member that is disposed between a collision position where the processing liquid scattered from the substrate collides with the cup and the substrate and for preventing the processing liquid having collided with the cup from reaching the surface of the substrate rotated held by the spin chuck.

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Patent Owner(s)

Patent OwnerAddress
SCREEN HOLDINGS CO LTDTENJINKITA-MACHI 1-1 TERANOUCHI-AGARU 4-CHOME HORIKAWA-DORI KAMIGYO-KU KYOTO-SHI KYOTO 602-8585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ANDO, Koji Kyoto-shi, JP 112 1688
MAEGAWA, Tadashi Kyoto-shi, JP 17 47
TAKEAKI, Rei Kyoto-shi, JP 12 39
YASUTAKE, Yosuke Kyoto-shi, JP 9 9

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