Die sorting apparatus and die sorting method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10734260
APP PUB NO 20180068880A1
SERIAL NO

15687209

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Abstract

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A die sorting apparatus includes a fixing mechanism for fixing a wafer having a plurality of dies, a positioning mechanism including an indicator for selecting a die of the wafer using die coordinates, an ejection mechanism below the wafer for applying a force to the selected die, a moving mechanism mechanically coupled to the positioning mechanism and the ejection mechanism for aligning the positioning mechanism with the ejection mechanism according to the die coordinates. The ejection mechanism includes an ejection shaft, a pin driven by the ejection shaft to apply the force to the selected die, and a pin driving device for moving the pin up and down through the ejection shaft. The die sorting apparatus also includes a die pickup device mounted in parallel to or integrated in the positioning mechanism for picking up the selected die that is separated form the wafer through the pin.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATIONSHANGHAI
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATIONNO 18 WEN CHANG RD ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA DAXING DISTRICT BEIJING 100716

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bai, Xin Xing Shanghai, CN 1 2
Yang, Chen Shanghai, CN 191 455

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