Semiconductor package device having glass transition temperature greater than binding layer temperature

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10224298
APP PUB NO 20180068962A1
SERIAL NO

15649474

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

In one or more embodiments, a micro-electromechanical systems (MEMS) package structure comprises a MEMS die, a conductive pillar adjacent to the MEMS die, a package body and a binding layer on the package body. The package body encapsulates the MEMS die and the conductive pillar, and exposes a top surface of the conductive pillar. A glass transition temperature (Tg) of the package body is greater than a temperature for forming the binding layer (Tc).

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Kuang-Hsiung Kaohsiung, TW 46 780
Lee, Yu-Ying Kaohsiung, TW 24 39
Syu, Wun-Jheng Kaohsiung, TW 6 44
Tsai, Yu-Hsuan Kaohsiung, TW 18 32
Wang, Sheng-Ming Kaohsiung, TW 31 148

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Sep 5, 2026
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 5, 2030
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00