Coefficient of thermal expansion (CTE) matched transistor outline (TO) header

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United States of America Patent

PATENT NO 10050410
APP PUB NO 20180069371A1
SERIAL NO

15433747

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Abstract

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A transistor outline (TO) package may include a TO cap. The TO package may include a TO header. The TO header may include a header stem of a first material and a first coefficient of thermal expansion (CTE) value. The TO header may include a header base of a second material and a second CTE value. The first material and the second material may be different. The first CTE value and the second CTE value may be different. The first CTE value and the second CTE value may be within a threshold percentage of each other.

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Patent Owner(s)

  • LUMENTUM OPERATIONS LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ding, Yaogeng Foster City, US 3 9
Guerin, Nicolas San Jose, US 20 607
Guo, Yonghong Union City, US 33 146
Wang, Lihua San Jose, US 96 694
Xu, Jack Milpitas, US 20 144

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