Electromagnetic bandgap structure and method for manufacturing the same
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United States of America Patent
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Mar 19, 2019
Grant Date -
Mar 8, 2018
app pub date -
Mar 8, 2017
filing date -
Sep 6, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed are an electromagnetic bandgap structure and a method for manufacturing the same. The electromagnetic bandgap structure includes a ground layer, a middle layer configured to include one or more patches, and to face the ground layer with a first dielectric layer interposed between the middle layer and the ground layer, wherein the first dielectric layer is stacked on a top of the ground layer, and a power layer configured to face the middle layer with a second dielectric layer interposed between the power layer and the middle layer, wherein the second dielectric layer is stacked on a top of the patches, wherein the patches and the power layer are electrically connected to each other through a via.
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