Substrate processing method and substrate processing device

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United States of America Patent

PATENT NO 10668497
APP PUB NO 20180071772A1
SERIAL NO

15559076

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In order to solve the problem of satisfactorily removing a resist from the surface of a substrate, the present invention is a substrate processing device (1) having a spin chuck (5) and an SPM feed unit (6) for feeding SPM to the substrate (W) held by the spin chuck (5), wherein the SPM feed unit (6) includes a mixing unit (30) for mixing an aqueous hydrogen peroxide solution and hydrofluoric acid and producing a liquid mixture of hydrogen peroxide water and hydrofluoric acid, and an HF-mixed SPM production unit (14) for mixing the liquid mixture and sulfuric acid and producing HF-mixed SPM.

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Patent Owner(s)

  • SCREEN HOLDINGS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akizuki, Yusuke Kyoto, JP 5 2

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