CURVED STACK STRUCTURES, MANUFACTURING METHODS THEREOF AND CURVED ELECTRONIC DEVICES
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United States of America Patent
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Issued Date -
Mar 15, 2018
app pub date -
Aug 24, 2017
filing date -
Sep 14, 2016
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Abstract
A curved stack structure is provided. The curved stack structure includes a base having a curved surface. An adhesive layer is disposed on the base, and a substrate is disposed on the adhesive layer, wherein the substrate has a first thickness that is greater than or equal to 0.01 mm and less than or equal to 0.4 mm. A fabrication method of the curved stack structure and a curved electronic device including the curved stack structure are also provided.
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