ELECTROPLATING APPARATUS, ELECTROPLATING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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United States of America Patent
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Sep 8, 2017
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Sep 9, 2016
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According to one embodiment, an electroplating method includes, arranging an anode having passages through which a plating solution flows and a cathode to face each other via a resist mask, in a reaction section storing the plating solution, and setting a potential of the cathode to a negative potential to the anode, to form a metal plated film on the surface of the cathode.
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