Electromigration monitor

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United States of America Patent

PATENT NO 10677833
APP PUB NO 20180074111A1
SERIAL NO

15805406

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A structure, such as a wafer, semiconductor chip, integrated circuit, or the like, includes a through silicon via (TSV) and an electromigration (EM) monitor. The TSV) includes at least one perimeter sidewall. The EM monitor includes a first EM wire separated from the perimeter sidewall of the TSV by a dielectric.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Fen Williston, US 115 816
Farooq, Mukta G Hopewell Junction, US 212 3727
Griesemer, John A Salt Point, US 11 108
Kothandaraman, Chandrasekaran Hopewell Junction, US 4 15
Safran, John M Wappingers Falls, US 29 356
Sullivan, Timothy D Underhill, US 138 1740
Wang, Ping-Chuan Hopewell Junction, US 190 2002
Zhang, Lijuan Beacon, US 63 312

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