WIRING BODY, WIRING BOARD, TOUCH SENSOR, AND PRODUCTION METHOD FOR WIRING BODY

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United States of America Patent

SERIAL NO

15553409

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Abstract

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A wiring body includes a resin layer, an electrode layer provided on a surface of the resin layer at one side and including a first line-like conductor layer, and a lead wiring layer provided on the surface of the resin layer at the one side and including one second line-like conductor layer. The at least one second line-like conductor layer is formed integrally with the electrode layer. The lead wiring layer has a single-layer structure made of a material having same composition as that of a material of which the electrode layer is made, and a following Expression is satisfied: T12. T1 is a thickness of the first line-like conductor layer, and T2 is a thickness of the second line-like conductor layer.

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Patent Owner(s)

Patent OwnerAddress
FUJIKURA LTDTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SHIOJIRI, Takeshi Chiba, JP 8 7

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