Method of forming substrates with a through via

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United States of America Patent

PATENT NO 10269585
APP PUB NO 20180076052A1
SERIAL NO

15696574

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Abstract

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Methods of forming a via in substrates include etching a damage region extending through a thickness of a stack of a plurality of substrates removably bonded together. Each of the substrates in the stack has at least one surface removably bonded to a surface of another substrate in the stack, wherein when the substrates in the stack are debonded, each substrate has at least one surface that has a surface roughness (Ra) of less than or equal to about 0.6 nm.

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Patent Owner(s)

  • CORNING INCORPORATED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jin, Yuhui Painted Post, US 103 602

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