Spot-Solderable Leads for Semiconductor Device Packages
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United States of America Patent
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Mar 15, 2018
app pub date -
Apr 13, 2017
filing date -
Sep 9, 2016
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Abstract
A semiconductor device that has at least one semiconductor chip attached to a leadframe made of sheet metal of unencumbered full thickness. The leadframe has leads of a first subset that alternate with leads of a second subset. The leads of the first and second subsets have elongated straight lead portions that are parallel to each other in a planar array. A cover layer of insulating material is located over portions of un-encapsulated lead surfaces. The portions of the leads of the first and second subsets that don't have the cover layer have a metallurgical configuration that creates an affinity for solder wetting.
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