SEMICONDUCTOR DEVICE PACKAGE
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United States of America Patent
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Aug 25, 2017
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Sep 9, 2016
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Abstract
A semiconductor device package includes a copper lead frame, a copper oxide compound layer and an encapsulant. The copper oxide compound layer is in contact with a surface of the copper lead frame. The copper oxide compound layer includes a copper(II) oxide, and a thickness of the copper oxide compound layer is in a range from about 50 nanometers to about 100 nanometers. The encapsulant is in contact with a surface of the copper oxide compound layer.
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