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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
ELUX INC	18110 SE 34TH STREET SUITE 480 VANCOUVER WA 98683

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Garner, Sean Mathew	Elmira, US	10	52
Heine, David Robert	Horseheads, US	16	46
Shinde, Avinash Tukaram	PUNE, IN	8	38

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Sep 15, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Sep 15, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 15, 2018	US,20180076352,A1   US20180076352A1	FIRST PUBLISHED PATENT APPLICATION
March 13, 2018	US,9917226,B1   US9917226B1	GRANTED PATENT AS FIRST PUBLICATION

Full Text

US Patent Application No: 2018/0076,352

Substrate Features for Enhanced Fluidic Assembly of Electronic Devices

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