Method for producing a semiconductor body

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United States of America Patent

PATENT NO 10468555
APP PUB NO 20180076359A1
SERIAL NO

15552181

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for producing a semiconductor body is disclosed. In an embodiment, the method includes providing a semiconductor body, applying a first mask layer and a second mask layer to the semiconductor body and forming at least one second mask opening in the second mask layer and at least one recess in the semiconductor body in a region of the at least one first mask opening in the first mask layer, wherein the recess comprises a side face and a bottom face and the recess forms an undercut with the second mask opening. The method further includes applying a passivation layer unpatterned to the second mask layer and to the side face and the bottom face of the at least one recess and removing the passivation layer so that the passivation layer remains at least in part on the side face of the at least one recess.

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Patent Owner(s)

  • OSRAM OPTO SEMICONDUCTORS GMBH

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eberhard, Franz Regensburg, DE 32 164

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