Method of manufacturing surface acoustic wave device chips

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United States of America Patent

PATENT NO 10826456
APP PUB NO 20180076784A1
SERIAL NO

15689889

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of manufacturing surface acoustic wave device chips includes grinding a reverse side of a wafer with a surface acoustic wave device formed in each area demarcated by a plurality of crossing projected dicing lines on a face side of the wafer; before or after grinding, applying a laser beam to the reverse side of the wafer such that the laser beam is focused at a position within the wafer, the position being closer to the face side of the wafer than a position corresponding to a reverse side of each of the surface acoustic wave device chips to be produced from the wafer, thereby forming a modified layer for diffusing an acoustic wave; and after grinding and applying the laser beam, dividing the wafer along the projected dicing lines into a plurality of the surface acoustic wave device chips.

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Patent Owner(s)

  • DISCO CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sekiya, Kazuma Tokyo, JP 208 1389

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