ELECTROCONDUCTIVE FILM AND METHOD FOR PRODUCING SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Dec 16, 2015
filing date -
Mar 16, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
To provide a copper electroconductive film formed on a paper substrate, the copper electroconductive film being considerably improved in weather resistance and electroconductivity. The problem can be achieved by an electroconductive film formed by pressing a sintered electroconductive film formed by sintering copper particles in a coating film containing copper powder on a paper substrate along with the substrate, the electroconductive film having an area ratio of copper occupying on a cross section of the electroconductive film in parallel to a thickness direction thereof of 82.0% or more. The electroconductive film can be produced by pressing, for example, by roll press to from 90 to 190° C., after light sintering.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully