Annealing apparatus using two wavelengths of radiation

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United States of America Patent

PATENT NO 10857623
APP PUB NO 20180099353A1
SERIAL NO

15838010

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Abstract

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A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

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Patent Owner(s)

  • APPLIED MATERIALS INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adams, Bruce E Portland, US 76 1480
Hunter, Aaron Muir Santa Cruz, US 90 888
Jennings, Dean Beverly, US 71 6569
Liang, Haifan Oakland, US 69 533
Mayur, Abhilash J Salinas, US 89 6377
Parihar, Vijay Fremont, US 37 5289
Ranish, Joseph M San Jose, US 183 4580
Yam, Mark Monte Sereno, US 55 1776

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