Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer

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United States of America Patent

PATENT NO 10159142
APP PUB NO 20180103540A1
SERIAL NO

15578701

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding.

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Patent Owner(s)

  • TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haruna, Yuusuke Kizugawa, JP 12 5
Hosoya, Yoshihiro Tokyo, JP 29 138
Kobayashi, Yukari Tokyo, JP 6 57
Sekiguchi, Kiyoharu Tokyo, JP 1 1
Tajima, Hiroshi Kizugawa, JP 42 202
Watanabe, Masahiro Kizugawa, JP 556 6806

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