CREATION OF HOLES AND SLOTS IN GLASS SUBSTRATES
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Oct 13, 2017
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Oct 13, 2016
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Abstract
The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the strengthened (e.g., ion exchanged) glass substrate, that may be followed by use of another, focused, laser beam to promote full separation about the perforated line.
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