Method of forming electrical connections using optical triggering for solder

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United States of America Patent

PATENT NO 10646943
APP PUB NO 20180147646A1
SERIAL NO

15361714

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.

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Patent Owner(s)

  • SEAGATE TECHNOLOGY LLC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Collins, Aaron Michael Minneapolis, US 6 16
Davidson, Paul Eden Prairie, US 26 179
Libby, Christopher R St. Paul, US 1 4
Matzke, Scott Daemon Shakopee, US 1 4

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