GLASS SUBSTRATE ASSEMBLIES HAVING LOW DIELECTRIC PROPERTIES
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Aug 19, 2016
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Aug 21, 2015
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Abstract
Glass substrate assemblies having low dielectric properties, electronic assemblies incorporating glass substrate assemblies, and methods of fabricating glass substrate assemblies are disclosed. In one embodiment, a substrate assembly includes a glass layer 110 having a first surface and a second surface, and a thickness of less than about 300 μm. The substrate assembly further includes a dielectric layer 120 disposed on at least one of the first surface or the second surface of the glass layer. The dielectric layer has a dielectric constant value of less than about 3.0 in response to electromagnetic radiation having a frequency of 10 GHz. In some embodiments, the glass layer is made of annealed glass such that the glass layer has a dielectric constant value of less than about 5.0 and a dissipation factor value of less than about 0.003 in response to electromagnetic radiation having a frequency of 10 GHz. An electrically conductive layer 142 is disposed on a surface of the dielectric layer, within the dielectric layer or under the dielectric layer.
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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
CORNING INCORPORATED | ONE RIVERFRONT PLAZA CORNING NY 14831 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Garner, Sean Matthew | Elmira, US | 75 | 1052 |
Lin, Jen-Chieh | Zhubei, TW | 52 | 110 |
Sorensen, Michael Lesley | Waverly, US | 27 | 185 |
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