Electronic package structure with improved board level reliability

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11011455
APP PUB NO 20180166365A1
SERIAL NO

15893591

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method for providing an electronic package structure includes providing a substrate having a die pad having a die pad top surface and an opposing die pad bottom surface, leads laterally spaced apart from the die pad, and a substrate encapsulant interposed between the die pad and the leads and includes a substrate top surface and an opposing substrate bottom surface. The substrate encapsulant is provided such that the die pad and the leads protrude outward from the substrate bottom surface. The method includes providing an electronic device having opposing major surfaces and a pair of opposing outer edges. The method includes connecting the electronic device to the substrate such that one major surface of the electronic device is spaced apart from the die pad top surface and upper surfaces of the leads, and the outer edges overlap an opposing pair of the leads.

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Patent Owner(s)

  • AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD.

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hwang, Tae Kyung Seoul, KR 9 87
Kang, Won Joon Seoul, KR 4 60
Kim, Gi Jeong Gyeonggi-do, KR 51 228
Sohn, Eun Sook Seoul, KR 12 200

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