Passive device assembly for accurate ground plane control

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10154591
APP PUB NO 20180177052A1
SERIAL NO

15896959

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.

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Patent Owner(s)

  • QUALCOMM INCORPORATED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Berdy, David Francis San Diego, US 61 433
Kim, Daeik Daniel Del Mar, US 84 609
Kim, Jonghae San Diego, US 314 3456
Velez, Mario Francisco San Diego, US 123 1131
Yun, Changhan Hobie San Diego, US 135 897
Zuo, Chengjie San Diego, US 146 1294

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