Polishing compositions
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United States of America Patent
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Jul 14, 2020
Grant Date -
Jul 5, 2018
app pub date -
Dec 27, 2017
filing date -
Dec 30, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present disclosure provides chemical mechanical polishing compositions that achieve minimal dishing at reduced dishing reducer (DR) levels when compared to known CMP compositions. The compositions of the disclosure include a dynamic surface tension reducer (DSTR) which allows for lower levels of dishing reducer in the compositions. Indeed, the compositions of the disclosure allow for lower levels of dishing reducer to achieve the same dishing as known compositions having higher levels of dishing reducer. Deleterious effects of high DR levels are thereby avoided or minimized when employing the compositions of the disclosure.
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