Method for inspecting pressure pulse wave sensor and method for manufacturing pressure pulse wave sensor
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United States of America Patent
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Nov 27, 2018
Grant Date -
Jul 12, 2018
app pub date -
Mar 7, 2018
filing date -
Sep 7, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A method for inspecting a pressure pulse wave sensor is provided. The sensor chip includes a recess which is recessed in a direction perpendicular to the pressure-sensitive face, and the pressure-sensitive element array is formed in a portion of the sensor chip whose thickness is reduced in the direction due to the recess. The method includes: bonding and fixing the sensor chip onto the substrate so that the recess communicates with atmospheric air through only the through hole of the substrate; connecting a substrate-side terminal portion of the substrate and the chip-side terminal portion through an electrically conductive member; and performing characteristic evaluation on the sensor chip based on a signal outputted from the substrate-side terminal portion in a state in which air is sucked through the through hole of the substrate to thereby apply negative pressure to the pressure-sensitive face.
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