POLYAMIDE RESIN COMPOSITION HAVING THERMAL AGING RESISTANCE AND METHOD FOR ENHANCING THERMAL AGING RESISTANCE OF POLYAMIDE RESIN
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Jul 22, 2016
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Jul 29, 2015
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Abstract
The present invention is a polyamide resin composition having a thermal aging resistance in a level which is resistant to a high-temperature and long-term environment of 200° C. and longer than 1000 hours. According to the present invention, there is provided a polyamide resin composition containing a polyamide resin (A) and another polyamide resin (B) which exhibits lower oxygen permeability than the polyamide resin (A), wherein a ratio by mass (A)/(B) of the polyamide resin (A) to the polyamide resin (B) is from 98/2 to 60/40, and wherein, to 100 parts by mass of the total amount of the polyamide resin (A) and the polyamide resin (B), 0.5 to 20 part (s) by mass of a metal cyanide salt of a composition formula (1) is compounded.
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