FLUORORESIN POROUS BODY, METAL LAYER-EQUIPPED POROUS BODY USING SAME, AND WIRING SUBSTRATE

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United States of America Patent

SERIAL NO

15744159

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Abstract

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To obtain a fluororesin porous body serving as a material achieving both an excellent low specific dielectric constant and an excellent low linear expansion coefficient, which has heretofore been difficult to obtain, and a metal layer-equipped porous body and a wiring substrate each using the fluororesin porous body, provided is a fluororesin porous body including a fluororesin matrix and hollow inorganic particles dispersed in the fluororesin matrix, in which the fluororesin matrix has a large number of pores.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATIONOSAKA 567-8680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kasagi, Tomoyuki Ibaraki-shi, JP 26 27
Kitagawa, Yuya Ibaraki-shi, JP 16 37

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