Copper alloy sputtering target and semiconductor element wiring

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10665462
APP PUB NO 20180211841A1
SERIAL NO

15926022

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A first copper alloy sputtering target comprising 0.5 to 4.0 wt % of Al and 0.5 wtppm or less of Si and a second copper alloy sputtering target comprising 0.5 to 4.0 wt % of Sn and 0.5 wtppm or less of Mn are disclosed. The first and/or the second alloy sputtering target can further comprise one or more elements selected from among Sb, Zr, Ti, Cr, Ag, Au, Cd, In and As in a total amount of 1.0 wtppm or less. A semiconductor element wiring formed by the use of the above targets is also disclosed. The above copper alloy sputtering target allows the formation of a wiring material for a semiconductor element, in particular, a seed layer being stable, uniform and free from the occurrence of coagulation during electrolytic copper plating and exhibits excellent sputtering film formation characteristics.

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Patent Owner(s)

Patent OwnerAddress
JX NIPPON MINING & METALS CORPORATIONTOKYO 100-8164

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyashita, Hirohito Ibaraki, JP 23 320
Okabe, Takeo Ibaraki, JP 37 308

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