Polishing composition and method for polishing magnetic disk substrate

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United States of America Patent

PATENT NO 10822525
APP PUB NO 20180215953A1
SERIAL NO

15935925

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Abstract

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Embodiments provide a polishing composition containing colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound. According to at leaset one embodiment, the water-soluble polymer compound is a copolymer containing a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.

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Patent Owner(s)

Patent OwnerAddress
YAMAGUCHI SEIKEN KOGYO CO LTD1631 SHIMIZUYAMA 2-CHOME MIDORI-KU NAGOYA-SHI AICHI 4598009

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwata, Toru Aichi, JP 116 1702
Sugawa, Akira Aichi, JP 5 10

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