CUTTING SYSTEM AND METHOD OF TISSUE CUTTING FOR MEDICAL TREATMENT

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United States of America Patent

APP PUB NO 20180228538A1
SERIAL NO

15897287

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Abstract

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Tissue cutting systems and methods of tissue cutting are provided. In one example, the tissue cutting system includes a first device and a second device adapted for coupling to a power supply. The first device includes a conductive probe. The second device includes a conductive material, for example, as part of an expandable structure, having an outer surface area of conductive material that may be larger than a surface area of the conductive probe. The conductive probe and the conductive material are deployed along opposite sides of a body tissue, such as an aortic dissection flap. Selective electrical power is applied to the conductive probe and the conductive material to cut the body tissue.

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Patent Owner(s)

Patent OwnerAddress
COOK MEDICAL TECHNOLOGIES LLC750 N DANIELS WAY BLOOMINGTON IN 47404

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Berwick, Zachary Costa Mesa, US 16 41
Chambers, Sean D Bloomington, US 46 1262
Kassab, Ghassan La Jolla, US 12 341
Kratzberg, Jarin A Lafayette, US 36 69
Krieger, Joshua F Topsfield, US 13 29
Noblet, Jillian Bloomington, US 2 1
Phillips, Matthew J Carlsbad, US 55 1455
Roeder, Blayne A Bloomington, US 176 3566
Roeder, Rebecca A Bloomington, US 5 347

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