Shape-forming packaging material, and method for producing power storage device with surface printing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11699823
APP PUB NO 20180233712A1
SERIAL NO

15893307

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The shape-forming packaging material is a shape-forming packaging material including a heat resistant resin layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer disposed between both the layers, and is configured such that a print improving resin layer is laminated on a further outer side of the heat resistant resin layer.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • SHOWA DENKO PACKAGING CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Minamibori, Yuji Kanagawa, JP 14 26
Nakajima, Daisuke Kanagawa, JP 109 351

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Jan 11, 2027
7.5 Year Payment $3600.00 $1800.00 $900.00 Jan 11, 2031
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jan 11, 2035
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00