Laser Ablation Devices That Utilize Beam Profiling Assemblies to Clean and Process Surfaces
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United States of America Patent
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Sep 6, 2018
app pub date -
Apr 13, 2018
filing date -
Apr 13, 2018
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Abstract
Laser ablation devices that utilize beam profiling assemblies to clean and process surfaces are described herein. A method includes directing a laser beam in a geometrical pattern at an arcuate surface of a cylindrical target, blocking a portion of the laser beam to prevent a portion of the geometrical pattern from contacting the cylindrical target, and rotating the cylindrical target as the laser beam contacts the arcuate surface so as to ablate the cylindrical target.
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