VIBRATION DAMPING MOUNT
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United States of America Patent
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Issued Date -
Sep 6, 2018
app pub date -
Feb 26, 2018
filing date -
Feb 26, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A MEMS sensor package includes a MEMS sensor fixed to a vibration damping mount. The mount includes a silicon substrate defining an outer frame; a moveable support to which the MEMS sensor is fixed; and a vibration damping structure connected between the outer frame and the moveable support to damp movement of the support. The MEMS sensor and vibration damping mount are enclosed by a casing that is backfilled with gas.
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