Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus
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United States of America Patent
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Issued Date -
Sep 6, 2018
app pub date -
Feb 28, 2018
filing date -
Feb 28, 2018
priority date (Note) -
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Abstract
To provide a surface-treated copper foil that is capable of favorably decreasing the transmission loss even used in a high frequency circuit board and has an improved peel strength on adhering to an insulating substrate, such as a resin. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has an average length of roughening particles of 0.030 μm or more and 0.8 μm or less, the roughening treatment layer has an average number of gap portions between the adjacent roughening particles of 20/100 μm or more and 1,700/100 μm or less, and the roughening treatment layer has a total frequency of an overlap frequency and a contact frequency of roughening particles of 120/100 μm or less.
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