Optical semiconductor component package and optical semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10483425
APP PUB NO 20180261714A1
SERIAL NO

15760947

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An optical semiconductor component package includes a base, a frame, a lid, and a light absorbing member located on an inner surface of the lid. The base is plate-like and has a first surface including a mount area in which an optical semiconductor component is mountable. The frame is located on the first surface and surrounds the mount area. The lid is plate-like and is bonded to the frame and covers the mount area. The light absorbing member is located on a second surface of the lid facing the mount area, and has a plurality of recesses on its surface.

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Patent Owner(s)

  • KYOCERA CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Egashira, Hidenobu Kirishima, JP 1 3
Taniguchi, Masahiko Kirishima, JP 93 943

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