SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD

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United States of America Patent

APP PUB NO 20180265989A1
SERIAL NO

15700694

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to an embodiment, a substrate treatment apparatus includes a noble metal-containing member having a concave-convex surface including a noble metal, and a liquid chemical supply member to supply a liquid chemical. While convex portions of the concave-convex surface are contact with a predetermined surface of a metal, the liquid chemical is supplied onto the surface of the metal to remove the metal with etching.

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Patent Owner(s)

Patent OwnerAddress
TOSHIBA MEMORY CORPORATION1-1 SHIBAURA 1-CHOME MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AKEBOSHI, Yuya Mie, JP 14 48
ITO, Fuyuma Mie, JP 15 14
KITAGAWA, Hakuba Mie, JP 12 9
YOSHIMIZU, Yasuhito Mie, JP 92 412

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