BONDING COMPOSITION
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United States of America Patent
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Issued Date -
Oct 18, 2018
app pub date -
Nov 1, 2016
filing date -
Nov 1, 2016
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Abstract
A bonding composition which can give high bonding strength by a relatively low bonding temperature, and at the same time, can inhibit the formation of the fillet while maintaining the sufficient spreading over the interface to be bonded, is provided. The present invention is related to a bonding composition comprising inorganic particles as a primary component and an organic component as a secondary component, wherein a viscosity of the composition decreases upon a rise in temperature, and the inorganic particles are sintered to each other following the decrease in viscosity. It is preferred that the viscosity at around 25° C. of the bonding composition is 10 to 50 Pa·s at a shear of 10 s−1.
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