HEAT DISSIPATION MATERIAL ADHERING COMPOSITION, HEAT DISSIPATION MATERIAL HAVING ADHESIVE, INLAY SUBSTRATE, AND METHOD FOR MANUFACTURING SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 18, 2018
app pub date -
Jun 15, 2016
filing date -
Jun 15, 2016
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. A heat dissipation material having adhesive is obtained by coating a portion or the whole of the heat dissipation material with a heat dissipation material adhering composition including a resin component containing an epoxy resin, a curing agent, and an inorganic filler, and having a complex viscosity at 80° C. of 1×103 Pa·s to 5×106 Pa·s.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully