Anodized Layer and Aluminum Layer over Substrate

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United States of America Patent

APP PUB NO 20180298499A1
SERIAL NO

15519697

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Various examples described herein provide for a substrate, or a method for preparing a substrate, including an aluminum layer and an anodized layer over a substrate. For instance, the substrate may comprise a substrate, a continuous aluminum layer formed over the substrate, and an anodized layer formed over the continuous aluminum layer.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT-PACKARD DEVELOPMENT COMPANY L P11445 COMPAQ CENTER DRIVE WEST HOUSTON TX 77070

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHANG, CHI HAO TAIPEI CITY, TW 50 14
KASHYAP, CHALAM FORT COLLINS, US 11 5
WU, KUAN-TING TAIPEI CITY, TW 217 485

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