PLASMA PROCESSING APPARATUS AND CONTROL METHOD

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United States of America Patent

APP PUB NO 20180301388A1
SERIAL NO

15947994

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a plasma processing apparatus including a microwave radiating mechanism configured to radiate microwaves output from a microwave output unit into a processing container. The microwave radiating mechanism includes: an antenna configured to radiate the microwaves; a dielectric member configured to transmit the microwaves radiated from the antenna, and form an electric field for generating surface wave plasma by the microwaves; a sensor provided in the microwave radiating mechanism or adjacent to the microwave radiating mechanism, and configured to monitor electron temperature of the generated plasma; and a controller configured to determine a plasma ignition state based on the electron temperature of the plasma monitored by the sensor.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325 107-6325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikeda, Taro Yamanashi, JP 158 2838
Osada, Yuki Yamanashi, JP 32 1309

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