Prepreg, metal-clad laminate and printed wiring board
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United States of America Patent
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Nov 12, 2019
Grant Date -
Nov 15, 2018
app pub date -
Sep 5, 2016
filing date -
Sep 15, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A prepreg includes: a woven fabric base; and a semi-cured product of a resin composition, which fills an inside of the woven fabric base and coats a surface of the woven fabric base. The resin composition includes a thermosetting resin, an inorganic filler, a first thermoplastic resin soluble in an organic solvent, and a second thermoplastic resin insoluble in an organic solvent. With respect to 100 parts by mass of the thermosetting resin, a content ratio of the inorganic filler ranges from 50 parts by mass to 150 parts by mass, inclusive, and a total content ratio of the first thermoplastic resin and the second thermoplastic resin ranges from 20 parts by mass to 50 parts by mass, inclusive.
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