BATTERY MODULE HOUSING AND PACKAGING
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United States of America Patent
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Issued Date -
Nov 22, 2018
app pub date -
Apr 25, 2018
filing date -
Apr 25, 2018
priority date (Note) -
Published
status (Latency Note)
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Abstract
A circuit assembly comprising a sealed interface is configured to isolate one of more electrical components. The assembly comprises a circuit board comprising a substrate and a cover comprising a polycarbonate material in connection with the substrate. The assembly further comprises an adhesive seal disposed around a perimeter surface of the cover. The adhesive seal comprises a UV curable adhesive having a chemical composition. The assembly further comprises a polyamide over-molded coating enclosing at least a portion of the circuit board and covering the adhesive seal.
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