Metrology Apparatus, Lithographic System, And Method Of Measuring A Structure
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United States of America Patent
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Dec 6, 2018
app pub date -
May 24, 2018
filing date -
May 24, 2018
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Abstract
A metrology apparatus is disclosed that measures a structure formed on a substrate to determine a parameter of interest. The apparatus comprises an optical system configured to focus radiation onto the structure and direct radiation after reflection from the structure onto a detector, wherein: the optical system is configured such that the detector detects a radiation intensity resulting from interference between radiation from at least two different points in a pupil plane field distribution, wherein the interference is such that a component of the detected radiation intensity containing information about the parameter of interest is enhanced relative to one or more other components of the detected radiation intensity.
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