Importance

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Abstract

The present disclosure is directed to polymer composites, and, particularly, thermally conductive polymer composites. The polymer composites can include from about 20 wt. % to about 80 wt. % of a base polymer resin; from about 1 wt. % to about 70 wt. % of thermoconductive filler material comprising thermoconductive particles having a plurality of electronegative functional groups at the surface of the particles, and having a thermal conductivity of at least 2 W/m*K; from about 0.01 wt. % to about 20 wt. % of an amphiphilic compatibilizer including a hydrophilic component and hydrophobic chain component; and, optionally, from about 0 wt. % to 50 wt. % of an additive. As compared to a control composition having 0.00 wt. % of the amphiphilic compatibilizer, the composite has (i) increased mechanical strength as measured by Izod impact testing, and, (ii) increased thermal conductivity as measured by through-plane or in-plane testing.

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First Claim