WAFER INSPECTION DEVICE AND MAINTENANCE METHOD FOR SAME
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United States of America Patent
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Dec 20, 2018
app pub date -
Oct 14, 2016
filing date -
Oct 14, 2016
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Abstract
There is provided a wafer inspection device that is capable of bringing a polishing wafer into proper contact with probes without lowering throughput. The total value T of a thickness t1 of a polishing plate, a thickness t2 of a polishing wafer and a magnitude t3 extending from a lower surface of a main body of a pogo frame to a lower end of each probe of a probe card is set to be larger than a magnitude t4 of a lip seal protruding from an upper surface of a chuck top.
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