COPPER ALLOY MATERIAL

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United States of America Patent

APP PUB NO 20190062874A1
SERIAL NO

15771847

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Abstract

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A copper alloy material has a composition including: 0.3 mass % or more and less than 0.5 mass % of Cr; 0.01 mass % or more and 0.15 mass % or less of Zr; and a Cu balance including inevitable impurities, wherein an average of crystal grain sizes is in a range of 0.1 mm or more and 2.0 mm or less, and a standard deviation of the crystal grain sizes is 0.6 or less.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATION2-3 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO 100-8117

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DAIRAKU, Kanta Iwaki-shi, JP 4 0
SAKAMOTO, Toshio Kitamoto-shi, JP 49 760
YANO, Shoichiro Iwaki-shi, JP 16 58

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