ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Mar 21, 2019
app pub date -
Nov 13, 2018
filing date -
Nov 13, 2018
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Abstract
Provided are an adhesive agent capable of providing sufficient electrical continuity to a substrate to which a preflux treatment has been applied and a method for connecting electronic components. There is used an adhesive agent comprising a (meth)acrylate having an epoxy group in one molecule and a radical polymerization initiator having a one minute half-life temperature of 110 degrees C. or more. A surplus adhesive agent component between terminals flows, whereby an imidazole component in a preflux, the component binding to an epoxy group of an epoxy group-containing acrylate, is drawn out thereby to be removed from a surface of the terminal.
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