Molding die and molding method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10843264
APP PUB NO 20190091767A1
SERIAL NO

16081723

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Abstract

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A molding die includes a first die having a through-hole; a second die inserted into the through-hole and configured to be movable relative to the first die; and first and second punches configured to be insertable into the through-hole, wherein an undercut molding part is provided on the second die, and a molding target is compression-molded in a cavity surrounded by inner side walls of the through-hole, the second die, the first punch, and the second punch.

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Patent Owner(s)

Patent OwnerAddress
DIAMET CORPORATIONNIIGATA-SHI NIIGATA 950-8640

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maruyama, Tsuneo Niigata, JP 43 185
Sakai, Hideo Niigata, JP 46 424
Tamura, Yoshiki Niigata, JP 9 24

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